DocumentCode :
118478
Title :
Electrical simulation of thin film inductors on silicon and glass substrates
Author :
Zheng Qin ; Cheng Pang ; Xiaoli Ren ; Wenya Shang ; Dongkai Shangguan ; Daquan Yu
Author_Institution :
Univ. of Chinese Acad. of Sci., Beijing, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
555
Lastpage :
559
Abstract :
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper, we designed two kinds of thin film spiral inductors on both silicon and glass substrates. One is monolayer structure and, another has double layers. The inductors we re modeled and simulated using Finite Element Method (FEM). And, the electrical analysis was performed by ANSYS HFSS an dQ3D.
Keywords :
elemental semiconductors; finite element analysis; glass; silicon; thin film inductors; ANSYS HFSS; FEM; Q3D; Si; discrete passive component; double layers; electrical simulation; electronic system; finite element method; glass substrates; monolayer structure; passive arrays; passive components; thin film spiral inductors; Couplings; Glass; Inductors; Metals; Q-factor; Silicon; Substrates; electronic packaging technology; glass substrate; passive component; thin film; thin film spiral inductor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922717
Filename :
6922717
Link To Document :
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