DocumentCode
118478
Title
Electrical simulation of thin film inductors on silicon and glass substrates
Author
Zheng Qin ; Cheng Pang ; Xiaoli Ren ; Wenya Shang ; Dongkai Shangguan ; Daquan Yu
Author_Institution
Univ. of Chinese Acad. of Sci., Beijing, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
555
Lastpage
559
Abstract
Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper, we designed two kinds of thin film spiral inductors on both silicon and glass substrates. One is monolayer structure and, another has double layers. The inductors we re modeled and simulated using Finite Element Method (FEM). And, the electrical analysis was performed by ANSYS HFSS an dQ3D.
Keywords
elemental semiconductors; finite element analysis; glass; silicon; thin film inductors; ANSYS HFSS; FEM; Q3D; Si; discrete passive component; double layers; electrical simulation; electronic system; finite element method; glass substrates; monolayer structure; passive arrays; passive components; thin film spiral inductors; Couplings; Glass; Inductors; Metals; Q-factor; Silicon; Substrates; electronic packaging technology; glass substrate; passive component; thin film; thin film spiral inductor;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922717
Filename
6922717
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