• DocumentCode
    118478
  • Title

    Electrical simulation of thin film inductors on silicon and glass substrates

  • Author

    Zheng Qin ; Cheng Pang ; Xiaoli Ren ; Wenya Shang ; Dongkai Shangguan ; Daquan Yu

  • Author_Institution
    Univ. of Chinese Acad. of Sci., Beijing, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    555
  • Lastpage
    559
  • Abstract
    Passive devices are widely used in all kinds of systems. Generally, most of the passive components in an electronic system are assembled as discrete components or passive arrays. Bu t a discrete passive component occupies a lot of space for the realization of its function. To overcome this shortcoming, one promising way is the integration of passive components into system in package. In this paper, we designed two kinds of thin film spiral inductors on both silicon and glass substrates. One is monolayer structure and, another has double layers. The inductors we re modeled and simulated using Finite Element Method (FEM). And, the electrical analysis was performed by ANSYS HFSS an dQ3D.
  • Keywords
    elemental semiconductors; finite element analysis; glass; silicon; thin film inductors; ANSYS HFSS; FEM; Q3D; Si; discrete passive component; double layers; electrical simulation; electronic system; finite element method; glass substrates; monolayer structure; passive arrays; passive components; thin film spiral inductors; Couplings; Glass; Inductors; Metals; Q-factor; Silicon; Substrates; electronic packaging technology; glass substrate; passive component; thin film; thin film spiral inductor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922717
  • Filename
    6922717