DocumentCode :
118493
Title :
Utilizing plating bar structure to enhance passive equalizer compensation technique
Author :
Chen-Chao Wang ; Hung-Chun Kuo ; Fu-Chen Chu ; You-Le Lin ; Tsai-Yun Hsieh ; Chi-Tsung Chiu ; Chih-Pin Hung ; Sheng-Hua Huang ; Chih-Wen Kuo
Author_Institution :
Corp. Design Div., Adv. Semicond. Eng. Inc., Kaohsiung, Taiwan
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
573
Lastpage :
576
Abstract :
In this paper, an open-stub compesation technique is proposed for passive equalizers used in high-speed digital communication systems. By simply lumping an open-stub to the conventional RL-type passive equalizer, the frequency-dependent channel loss from the long transmission path can be compensated, the frequency response of the channel becomes more flat and the bandwidth is wider. Compared proposed passive equalizer with typical RL passive equalizers, the simulation result shows this technique can improve 1 GHz in the flat region of S21 on a 60cm long differential pair. This technique is successfully demonstrated the improvement of electrical performance about 57.4% on time domain.
Keywords :
UHF circuits; compensation; digital communication; equalisers; frequency response; passive networks; RL-type passive equalizer; differential pair; frequency 1 GHz; frequency response; frequency-dependent channel loss; high-speed digital communication systems; long transmission path; open-stub compensation technique; passive equalizer compensation technique; plating bar structure; size 60 cm; time domain; Bandwidth; Data communication; Electronics packaging; Equalizers; Frequency response; Impedance; Time-domain analysis; Passive equalizer; eye opening; frequence-dependent loss; intersymbol interference (ISI); open stub;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922721
Filename :
6922721
Link To Document :
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