DocumentCode
118497
Title
A novel method for IR-drop reduction in high-performance printed circuit boards
Author
Yue-Hui Huang ; Mu-Shui Zhang ; Hong-Zhou Tan
Author_Institution
Dept. of Electron. & Commun. Eng., Sun Yat-sen Univ., Guangzhou, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
583
Lastpage
586
Abstract
In this paper, we studied the problem of IR drop of high performance multilayer printed circuit boards (PCBs). Adaptive mesh is used to simplify the process and improve efficiency. It is found that both vias contact of voltage regulator module (VRM) and the copper planes produce significant IR drop. A novel method for IR drop reduction is proposed, which can significantly reduce the resistance introduced by vias contact of VRM and copper planes. This method can reduce IR drop by about 50%. Furthermore, we also discuss the IR drop reduction for multi-plane structures. With reasonable design rules, the IR drop of PCBs with current demand of 100+A can be kept within a few tens of millivolt.
Keywords
printed circuit design; vias; IR-drop reduction; PCB; adaptive mesh; copper planes; high performance multilayer printed circuit boards; multiplane structures; vias contact; voltage regulator module; Arrays; Copper; Finite element analysis; Printed circuits; Resistance; Voltage control; IR drop; printed circuit board(PCB); resistance; through via; voltage regulator module(VRM);
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922723
Filename
6922723
Link To Document