DocumentCode :
118554
Title :
Simulation of effects of package parasitics on modulation characteristics of semiconductor lasers
Author :
Yongyong Lu ; Sheng Hu ; Yonglin Yu
Author_Institution :
Wuhan Nat. Lab. for Optoelectron., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
660
Lastpage :
663
Abstract :
The paper extend a integrated TLLM model to investigate the characteristics of directly modulated semiconductor lasers (DMLs). The model combines an equivalent circuit laser model and a transmission-line laser model (TLLM) for both electrical and optical issues. Microwave aspects such as high-frequency parasitic effects and impedance matching networks of laser diodes can be included in equivalent circuit model. The TLLM model takes into account important considerations such as inhomogeneous effects, carrier-induced refractive index change, spectral dependence of gain and so on. Both electrical and optical properties of a DFB laser are simulated with the model, including the microwave characteristics of package parasitics, intensity response and transient analysis under direct modulation.
Keywords :
electronics packaging; impedance matching; microwave photonics; optical communication equipment; optical modulation; passive optical networks; refractive index; semiconductor lasers; DFB laser; carrier-induced refractive index change; directly modulated semiconductor lasers; electrical properties; equivalent circuit laser model; gain; high-frequency parasitic effects; impedance matching networks; inhomogeneous effects; integrated TLLM model; intensity response; laser diodes; microwave aspects; modulation characteristics; optical properties; package parasitics; spectral dependence; transmission-line laser model; Integrated circuit modeling; Laser modes; Masers; Mathematical model; Modulation; Semiconductor device modeling; Semiconductor lasers; direct intensity modulation; equivalent circuit modeling; package parasitics; semiconductor laser; transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922741
Filename :
6922741
Link To Document :
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