DocumentCode :
118561
Title :
A new fast moisture sensitivity analysis method using equal moisture distribution simulation
Author :
Xiaosong Ma
Author_Institution :
Dept. of Mech. Eng., Guilin Univ. of Electron. Technol., Guilin, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
676
Lastpage :
679
Abstract :
MSLA, the abbreviation of Moisture Sensitivity Level Analysis, is the meaning of moisture sensitivity level analysis. MSLA is to give the proposed package moisture sensitivity of surface mount components provide a standard of classification, so that different types of components to get the correct packaging, storage and handling to avoid moisture resulted failures in the assembly or repair process. But traditional moisture sensitivity level characterizations take long time even the fast level 1, 85°C/85%RH conditioning needs 168 hours. The purpose of the paper is introducing a fast moisture diffusion method using high temperature and high relative humidity to increase moisture diffusion speed by numerical simulation, which will assist the moisture diffusion time.
Keywords :
assembling; diffusion; maintenance engineering; moisture; numerical analysis; sensitivity analysis; surface mount technology; MSLA; assembly process; classification standard; component handling; component storage; equal moisture distribution simulation; fast moisture diffusion method; fast moisture sensitivity analysis method; moisture sensitivity level analysis; numerical simulation; packaging; repair process; surface mount components; Acceleration; Materials; Moisture; Packaging; Qualifications; Sensitivity; Standards; equal moisture distribution; fast moisture diffusion; moisture diffusion model; moisture sensitivity level analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922744
Filename :
6922744
Link To Document :
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