Title :
The optimization of thermal performance in power electronics modules
Author :
Evans, Pete ; Castellazzi, Alberto ; Johnson, C.M. ; Hua Lu ; Bailey, Christopher
Author_Institution :
Univ. of Nottingham, Nottingham, UK
Abstract :
The development of a framework for the analysis and design optimization of power electronics module is described in this paper. This framework consists of analysis software that is capable of carrying out detailed dynamic as well as steady state electric and thermal analysis on power modules using finite difference numerical method and a black-box optimization solver that is based on the Mesh Adaptive Direct Search technique. Examples are given to show the application of the framework in the optimization of the thermal performance of a simplified module that consists of active semiconductor devices, ceramic substrate and baseplate.
Keywords :
ceramics; circuit optimisation; electronic engineering computing; finite difference methods; power electronics; semiconductor devices; thermal analysis; active semiconductor devices; analysis software; baseplate; black-box optimization solver; ceramic substrate; design optimization; finite difference numerical method; mesh adaptive direct search technique; power electronics modules; steady state electric analysis; thermal analysis; Algorithm design and analysis; Equations; Mathematical model; Multichip modules; Numerical models; Optimization; Power electronics; Electric-Thermal; Optimization; Power Module;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922755
