Title :
Thermal analysis for COB based on glass substrate
Author :
Xin Chen ; Yiping Wu
Author_Institution :
Sch. of Mater. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
Abstract :
As a novel packaging material, glass has good light transmission and insulation, getting people´s attention. In the paper, ANSYS software was used to simulate heat dissipation performance of the chip-on-board for LED chips packaging on glass substrate, analyze effects of the substrate material, substrate thickness, chip gaps, chip sizes and convection conditions on COB heat dissipation performance based on glass substrate. Finally, by ANSYS software an optimized analysis was made to optimize the thermal management scheme of COB based on glass substrate, find the optimized packaging structure, so that it could be used in actual production.
Keywords :
chip-on-board packaging; cooling; electronic engineering computing; finite element analysis; glass; light emitting diodes; thermal analysis; thermal management (packaging); ANSYS software; COB heat dissipation performance; LED chip packaging; chip gaps; chip sizes; chip-on-board; glass substrate; heat dissipation performance; insulation; light transmission; optimized packaging structure; packaging material; substrate material; substrate thickness; thermal analysis; thermal management scheme; Glass; Heating; Junctions; Light emitting diodes; Substrates; Thermal resistance; COB; glass substrate; heat dissipation; thermal analysis; thermal simulation;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922764
