• DocumentCode
    1186365
  • Title

    Timing vulnerability factors of sequentials

  • Author

    Seifert, Norbert ; Tam, Nelson

  • Author_Institution
    Logic Technol. Dev. Q&R, Intel Corp., Hillsboro, OR, USA
  • Volume
    4
  • Issue
    3
  • fYear
    2004
  • Firstpage
    516
  • Lastpage
    522
  • Abstract
    Single-event upsets (SEU) from particle strikes have become a key challenge in microprocessor design. Modern superpipelined microprocessors typically contain many thousands of sequentials whose soft-error rate (SER) cannot be neglected any more. An accurate assessment of the SER of sequentials is therefore crucial. This work describes a method for computing timing vulnerability factors (TVFs) of sequentials. Our methology captures the impact of the circuit environment which sequentials are typically placed in. Further, upsets occurring in local clock nodes have been accounted for. Results are presented for master-slave type flip flops and for flow-through latches of a high-performance microprocessor. Our investigations demonstrate that TVFs are a strong function of the propagation delay of the combinational logic and typically vary between ∼0% and 50%. For high-performance microprocessors, we predict average TVF values of the order of 20%-30%. Further, we expect TVFs to be largely technology independent for the same design.
  • Keywords
    flip-flops; microprocessor chips; radiation hardening (electronics); sequential circuits; timing jitter; SEE; SER; SEU; combinational logic; flow-through latches; high-performance microprocessor; jitter; local clock nodes; master-slave type flip flops; microprocessor design; particle strikes; propagation delay; radiation effects; sequential logic circuits; single-event upsets; soft-error rate; superpipelined microprocessors; timing vulnerability factors; Circuit faults; Clocks; Latches; Logic devices; Microprocessors; Propagation delay; Radiation effects; Single event transient; Single event upset; Timing;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.831993
  • Filename
    1369214