Title :
Microwave multichip module tridimensional assembly technology based on LTCC
Author_Institution :
Aerosp. Electron. Manuf. Center, Acad. of Space Electron. Inf. Technol., Xi´an, China
Abstract :
With the evolution of microwave substrate, microwave multichip modules are developing towards multilayer. Combined with SMT, high-precision chip assembly, circuit connection, anti-influence partition soldering, module integration technology and so on, those multilayer products constructed by utilizing LTCC technology are attractive candidates to satisfy the demand for telecommunication systems with miniaturized size, intergrated structure and light weight.
Keywords :
assembling; ceramic packaging; microwave circuits; multichip modules; multilayers; surface mount technology; LTCC technology; SMT; antiinfluence partition soldering; circuit connection; high-precision chip assembly; microwave multichip module tridimensional assembly technology; microwave substrate evolution; module integration technology; multilayer product; telecommunication system; Assembly; Microwave circuits; Microwave filters; Substrates; Three-dimensional displays; LTCC; multichip module; tridimensional assembly;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922772
