A novel high performance 40GHz hermetic SMT ceramic package for microwave applications

Author

Qiao Zhizhuang ; Gao Ling ; Liu Linjie

Author_Institution

13th Res. Inst., CETC, Shijiazhuang, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

815

Lastpage

819

Abstract

A novel high performance SMT (surface mount-type) ceramic package is proposed in this paper. In order to improve the transmission properties of the package, several key points of the simulation and design technologies for high frequency SMT package are proposed. The package has a surface mount terminal with a coplanar structure. The hermetic SMT package prototype samples are manufactured and measured. The measured results show the return loss below -20dB and the low insertion loss less than 0.6dB in the frequency range from DC to 40GHz. It is confirmed that this surface mount-type package shows high transmission properties as well as high thermal and mechanical reliability.

Keywords

ceramic packaging; microwave technology; reliability; surface mount technology; coplanar structure; design technology; frequency 40 GHz; high-performance hermetic SMT ceramic package; high-performance surface mount-type ceramic package; insertion loss; mechanical reliability; microwave application; package transmission properties; return loss; surface mount terminal; thermal reliability; Ceramics; Insertion loss; Loss measurement; Radio frequency; Reliability; Temperature measurement; Thermal conductivity; ceramic packaging; reliability testing; surface mounting;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922773

Filename

6922773