• DocumentCode
    118649
  • Title

    Back drilling in high-speed interconnect system

  • Author

    Xu Wang ; Weidong Ding

  • Author_Institution
    Res. Inst. of Electron. Sci. & Technol., UESTC, Chengdu, China
  • fYear
    2014
  • fDate
    12-15 Aug. 2014
  • Firstpage
    825
  • Lastpage
    828
  • Abstract
    In recent years, power noise, switching noise (SSN), jitter and so on are gradually becoming the hot research issues in high-speed interconnect system with the signal rate rising. At the same time, the resonance distributing in the Printed Circuit Board (PCB) may also lead to the instability of the signals. Because of the high speed of the signals, the model of the PCB vias is no longer the simple channel connection with the different layers, otherwise it will destroy the continuous impedance of the signals. So Electro-Magnetic Interference (EMI) will occur as a result of discontinuous impedance in the PCB. In this paper, we propose a new way which calls back drilling to avoid the resonance and optimize the signal performance.
  • Keywords
    circuit noise; drilling; electromagnetic interference; jitter; printed circuit interconnections; switching circuits; EMI; PCB; SSN; back drilling; channel connection; discontinuous impedance; electromagnetic interference; high-speed interconnect system; jitter; power noise; printed circuit board; signal instability; switching noise; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Parasitic capacitance; Time-domain analysis; EMI; back drilling; high-speed; interconnect;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
  • Conference_Location
    Chengdu
  • Type

    conf

  • DOI
    10.1109/ICEPT.2014.6922775
  • Filename
    6922775