DocumentCode
118649
Title
Back drilling in high-speed interconnect system
Author
Xu Wang ; Weidong Ding
Author_Institution
Res. Inst. of Electron. Sci. & Technol., UESTC, Chengdu, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
825
Lastpage
828
Abstract
In recent years, power noise, switching noise (SSN), jitter and so on are gradually becoming the hot research issues in high-speed interconnect system with the signal rate rising. At the same time, the resonance distributing in the Printed Circuit Board (PCB) may also lead to the instability of the signals. Because of the high speed of the signals, the model of the PCB vias is no longer the simple channel connection with the different layers, otherwise it will destroy the continuous impedance of the signals. So Electro-Magnetic Interference (EMI) will occur as a result of discontinuous impedance in the PCB. In this paper, we propose a new way which calls back drilling to avoid the resonance and optimize the signal performance.
Keywords
circuit noise; drilling; electromagnetic interference; jitter; printed circuit interconnections; switching circuits; EMI; PCB; SSN; back drilling; channel connection; discontinuous impedance; electromagnetic interference; high-speed interconnect system; jitter; power noise; printed circuit board; signal instability; switching noise; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Parasitic capacitance; Time-domain analysis; EMI; back drilling; high-speed; interconnect;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922775
Filename
6922775
Link To Document