Simulation study of a novel TSV structure

A novel TSV structure, formed by two semi-cylinders combining with a quadrangular is proposed and analyzed in this paper. This novel structure can enhance the density of TSV array without significantly decreasing transmission performance and reducing impedance mismatch in TSV-RDL transmission line or depressing the signal crosstalk. Effects of design parameters, such as the side length of quadrangular and the connection angle between TSV and the Redistribution Layer (RDL) are investigated and concluded by a 3D electromagnetic solver. Performance comparison between the novel TSV structure and the traditional one is also provided by simulation. The simulation results show that the novel TSV structure has excellent performance in some respects and can be used as a good substitution of traditional TSV when the TSV array density needs to be increased or the space for processing TSV is limited.