Signal integrity analysis of a high-performance processor package with silicon interposer

Author

Xiaoli Ren ; Cheng Pang ; Feng Jiang ; Zheng Qin ; Kai Xue ; Haiyan Liu ; Daquan Yu

Author_Institution

Nat. Center for Adv. Packaging, Wuxi, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

833

Lastpage

837

Abstract

This paper presents signal integrity analysis of a high-performance processor package with silicon interposer. Thediewas attached on the top side of the siliconinterposer with through silicon vias (TSVs), and theinterposer was connected to the organic substrate. The signal transmission path of this package consists of two redistribution layers (RDLs), TSVson interposer, and wirings on the substrate. The detailed signal integrity analysis with 3D full-wave electromagnetic method and equivalent circuit method are presented to verify the signaltransmission characteristics of the system. The co-simulation of this 2.5D package including silicon interposer and organic substrate is also presented in this paper.

Keywords

elemental semiconductors; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; silicon; three-dimensional integrated circuits; 2.5D package; 3D full-wave electromagnetic method; TSV; equivalent circuit; organic substrate; processor package; redistribution layers; signal integrity analysis; signal transmission path; silicon interposer; through silicon via; Conferences; Fabrication; Insertion loss; Propagation losses; Silicon; Substrates; Through-silicon vias; electrical simulation; signal integrityanalysis; silicon interposer; through silicon vias; transmissioncharacteristics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922777

Filename

6922777