Title :
Power QFN Tiger device down bond bond-ability study
Author :
Hanmin Zhang ; Hu, Minglie ; Yin, B.G. ; He, Q.C. ; Ye, D.H. ; Sonder Wang
Author_Institution :
Sch. of Electron. Inf. Eng., Tianjin Univ., Tianjin, China
Abstract :
Power QFN Tiger device failed the down bond open on TC500 or application. Failure analysis verified that it was caused by down bond delamination. Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point. Meanwhile, new bonding model with security loop was applied to down bond to improve the bond-ability and passed all reliability test.
Keywords :
bonding processes; circuit reliability; delamination; electronics packaging; failure analysis; finite element analysis; stress analysis; PQFN tiger device; TC500; bond stress; bond-ability study; delamination; failure analysis; finite element analysis; power quad flat no-lead tiger device; reliability testing; security loop; Analytical models; Bonding; Delamination; Reliability; Security; Stress; Wires; Delamination; Down bond; Heel broken; Power QFN;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922778
