DocumentCode
118658
Title
Power QFN Tiger device down bond bond-ability study
Author
Hanmin Zhang ; Hu, Minglie ; Yin, B.G. ; He, Q.C. ; Ye, D.H. ; Sonder Wang
Author_Institution
Sch. of Electron. Inf. Eng., Tianjin Univ., Tianjin, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
838
Lastpage
841
Abstract
Power QFN Tiger device failed the down bond open on TC500 or application. Failure analysis verified that it was caused by down bond delamination. Finite Element Analysis modeling was established to analyze the Tiger down bond stress and find out a new position with relative less stress impact as down bond end point. Meanwhile, new bonding model with security loop was applied to down bond to improve the bond-ability and passed all reliability test.
Keywords
bonding processes; circuit reliability; delamination; electronics packaging; failure analysis; finite element analysis; stress analysis; PQFN tiger device; TC500; bond stress; bond-ability study; delamination; failure analysis; finite element analysis; power quad flat no-lead tiger device; reliability testing; security loop; Analytical models; Bonding; Delamination; Reliability; Security; Stress; Wires; Delamination; Down bond; Heel broken; Power QFN;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922778
Filename
6922778
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