Strain field simulation of transferring process on large wafers

Wafer transferring process is often used in the semiconductor packaging equipment. Wafer transferring system is an essential part in the IC equipment. Smooth and efficiency are the design requirement of wafer transferring. As the rising of smart phones and tablet PCs, thin wafer is increasingly demanding. Large and thin wafer is susceptible to damage because of gravity during transmission, which greatly affect the efficiency and reliability of IC package. To get small deformation of the wafer, this paper analyzes the material parameters of the wafer, and simulates numerically the wafer deformation of different thicknesses and contact methods. Based on supporting points´ transmission method, the relationship between the distribution of points and wafer deformation is studied. Aiming at the minimal deformation, the distribution of supporting points is determined by optimal design method.