Title :
A novel modeling of TSV MOS capacitance by finite difference method
Author :
Cheng Huang ; Sheng Liu ; Jianping Zhu ; Wanchun Tang ; Wei Zhuang
Author_Institution :
Nanjing Univ. of Sci. & Technol., Nanjing, China
Abstract :
This paper proposed a novel modeling of the TSV MOS capacitance by finite difference (FD) method without the assumption of the full depletion approximation (FDA). The potential distribution in the oxide liner and depletion region can be obtained by FD with only one iteration. With the potential distribution, the TSV capacitance-voltage (C-V) characteristics can be easily obtained and good agreements are achieved with other references.
Keywords :
MOS capacitors; finite difference methods; three-dimensional integrated circuits; C-V characteristics; FD method; TSV MOS capacitance modeling; capacitance-voltage characteristics; depletion region; finite difference method; oxide liner; potential distribution; through silicon via technology; Capacitance; Capacitance-voltage characteristics; Electric potential; Finite difference methods; Mathematical model; Silicon; Through-silicon vias; Capacitance-voltage characteristics; Finite difference (FD) method; Through-silicon via (TSV);
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922789