Title :
The origins of leaky characteristics of Schottky diodes on p-GaN
Author :
Yu, L.S. ; Jia, L. ; Qiao, D. ; Lau, S.S. ; Li, J. ; Lin, J.Y. ; Jiang, H.X.
Abstract :
The possible origins of the leaky characteristics of a Schottky barrier on p-GaN have been investigated. The as-grown samples did not show any electrical activity using Hall measurements. Ni diodes made on as-activated samples, either at 950°C for 5 s or at 750°C for 5 min exhibited quasiohmic behavior. Upon sequential etching of the sample to remove a surface layer of 150 Å, 1200 Å, and 5000 Å from the sample, the I-V behavior became rectifying. I-V-T measurements showed that the slopes of the lnI-V curves were independent of the temperature, indicative of a prominent component of carrier tunneling across the Schottky junction. C-V measurements at each etch-depth indicated a decreasing acceptor concentration from the surface. The highly doped (>1.7 × 1019 cm-3) and defective surface region (within the top 150 Å from surface) rendered the as-activated Schottky diodes quasiohmic in their I-V characteristics. The leaky I-V characteristics, often reported in the literature, were likely to originated from the surface layer, which gives rise to carrier tunneling across the Schottky barrier. This highly doped/defective surface region, however, can play an important role in ohmic contact formation on p-GaN.
Keywords :
III-V semiconductors; Schottky barriers; Schottky diodes; gallium compounds; heavily doped semiconductors; hole density; leakage currents; semiconductor-metal boundaries; solid-state rectifiers; tunnelling; wide band gap semiconductors; 150 to 5000 A; 750 C; 950 C; Ni diodes; Ni-GaN; Schottky barrier; Schottky diodes; acceptor concentration; carrier tunneling; leaky I-V characteristics; ohmic contact formation; p-GaN; quasiohmic behavior; rectifying I-V characteristics; sequential etching; Atomic measurements; Electric variables measurement; Etching; Gallium nitride; Ionization; Schottky barriers; Schottky diodes; Semiconductor diodes; Temperature dependence; Tunneling;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2002.808558