Title :
Effect of temperature cycling on reliability of flip chip solder joint
Author :
Xueming Jiang ; Pengrong Lin ; Yuezhong Song ; Yingzhuo Huang ; Binhao Lian ; Quanbin Yao
Author_Institution :
Beijing Microelectron. Technol. Inst., Beijing Aerosp. Syst. Eng. Res. Inst., Beijing, China
Abstract :
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can effectively improve the thermal fatigue life of solder joints. The content of PbSn bumps in Sn has significant influence on the solder joint reliability.
Keywords :
failure analysis; flip-chip devices; reliability; thermal stress cracking; tin compounds; UBM structure; alumina ceramic substrate; chrysanthemum link design; electrically-connected test; failure analysis; flip chip bonding specimen failure; flip chip device; flip chip sample; flip chip solder joint reliability; lead tin bump; solder joint fatigue life; temperature cycling effect; thermal fatigue life; tin lead solder joint reliability; Fatigue; Flip-chip devices; Reliability; Soldering; Stress; Substrates; Tin; Flip chip; High temperature cycle; Reliability; Underfill;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922813
