DocumentCode :
118763
Title :
Failure analysis of Sm2Co17 type permanent magnet for high temperature
Author :
Yan Yao ; Shengxiang Bao ; Zhang XiaoWen ; Wang Zuwen ; Shen Anguo ; Zhang Ming
Author_Institution :
State Key Lab. of Electron. Thin Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1010
Lastpage :
1014
Abstract :
With the increasing using temperature, the magnetic performance of high temperature stable Sm2Co17 type permanent magnet will be decreased. In order to explore the effect of the high temperature on microstructure of the alloy, the differential thermal analysis (DTA) was made and three distinct phase transformation temperature 254 °C, 342 °C and 540 °C were obtained. Then X-ray diffraction (XRD), scanning electron microscopy (SEM) and X-ray energy dispersive spectrometer equipped (EDS) were used to analyze the phase information, microstructure and composition of the samples treated at the above temperatures. The results suggested that the oxidation and precipitation of Cu and Fe are the key reason to result in the failure of the material, which provides an important reference for the research of the magnet.
Keywords :
X-ray chemical analysis; X-ray diffraction; X-ray spectrometers; cobalt alloys; differential thermal analysis; failure analysis; oxidation; permanent magnets; precipitation; samarium alloys; scanning electron microscopy; DTA; EDS; SEM; Sm2Co17; X-ray diffraction; X-ray energy dispersive spectrometer; XRD; alloy microstructure; differential thermal analysis; failure analysis; magnetic performance; oxidation; permanent magnet; phase information; phase transformation temperature; precipitation; sample composition; scanning electron microscopy; temperature 254 degC; temperature 342 degC; temperature 540 degC; Iron; Materials; Permanent magnets; Scanning electron microscopy; X-ray scattering; Sm2Co17 type permanent magnetic alloy; heat treatment; oxidation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922818
Filename :
6922818
Link To Document :
بازگشت