Title :
Morphology, kinetics and service reliability of Cu6Sn5 texture formed on Sn/Cu interface
Author :
Zhihao Zhang ; Huijun Cao ; Yong Xiao ; Mingyu Li
Author_Institution :
Shenzhen Grad. Sch., Harbin Inst. of Technol., Shenzhen, China
Abstract :
We proposed a hexagonal-rod growth behavior to describe the growth mechanism of the intermetallic Cu6Sn5 phase inside the liquid Sn-base solder. We found that the interfacial Cu6Sn5 phase formed on Sn/Cu joint interface also has the similar characteristics in terms of the shapes and surface textures. Based on this anisotropic growth behavior, a supply-controlled kinetic model of Cu6Sn5 phase was established. In addition, this study could deepen our understanding of the solid-state phase transformation in Cu6Sn5, and also be of great significance in the interfacial reliability of solder interconnections.
Keywords :
interconnections; reliability; solders; surface texture; Cu6Sn5; anisotropic growth behavior; hexagonal-rod growth behavior; interfacial reliability; intermetallic compound phase; liquid tin-base solder; service reliability; solder interconnections; solid-state phase transformation; supply-controlled kinetic model; surface textures; tin-copper joint interface; Intermetallic; Kinetic theory; Liquids; Morphology; Shape; Substrates; Surface morphology; Cu6Sn5; anisotropic growth; hexagonal-rod shape; kinetics; service reliability;
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
DOI :
10.1109/ICEPT.2014.6922827
