Acceleration of the growth of tin whisker by thermal aging and external tension

Author

Yao, Z.X. ; Yin, L.M. ; Lu, Y.H. ; Gang, W. ; Chen, Z.G.

Author_Institution

Sch. of Metall. & Mater. Eng., Chongqing Univ. of Sci. & Technol., Chongqing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

1096

Lastpage

1099

Abstract

The effect of thermal aging temperature and external tension on the formation and growth of tin whisker from Sn electroplating coating was studied by use of scanning electron microscopy(SEM)in this article. It is shown that the unbiased temperature accelerates the formation and growth of tin whisker. However external tension do not obviously promote the formation and growth of tin whisker. After coating is added external tension in ambient temperature storage, the formation of tin whisker is completely inhibited. The compressive stress is necessary condition leading to the growth of tin whisker.

Keywords

ageing; electroplated coatings; electroplating; scanning electron microscopy; tin; whiskers (crystal); SEM; Sn; ambient temperature; compressive stress; electroplating coating; external tension; scanning electron microscopy; thermal aging; tin whisker growth; unbiased temperature; Aging; Coatings; Compressive stress; Copper; Surface treatment; Tin; electroplating tin coating; external tension; thermal aging; tin whisker;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922835

Filename

6922835