Thermo-mechanical reliability of 3D package under different thermal cycling

Author

Tianbao Lan ; Fei Su

Author_Institution

Beihang Univ., Beijing, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

1138

Lastpage

1141

Abstract

In this paper, thermo-mechanical reliability of a three-dimensional (3D) package based on through-silicon-via (TSV) under different thermal cycling was investigated with finite element method. A finite element simulation of this 3D package was performed in order to compare the thermal stress and fatigue lives of the solder joints with and without underfill. It was found that the fatigue live of solder joints was extended by using of unerfill. The influence of TSV arrangement on the fatigue life of solder was compared.

Keywords

fatigue; finite element analysis; integrated circuit packaging; integrated circuit reliability; solders; thermal stresses; three-dimensional integrated circuits; 3D package; TSV arrangement; finite element method; finite element simulation; solder fatigue life; solder joints; thermal cycling; thermal stress; thermomechanical reliability; three-dimensional package; through-silicon-via; underfill; Creep; Fatigue; Finite element analysis; Silicon; Soldering; Stress; Through-silicon vias; fatigue life; solder joint; three-dimensional package finite element;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922844

Filename

6922844