• DocumentCode
    1188425
  • Title

    A linear programming-based algorithm for floorplanning in VLSI design

  • Author

    Kim, Jae-Gon ; Kim, Yeong-Dae

  • Author_Institution
    Sch. of Ind. Syst. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    22
  • Issue
    5
  • fYear
    2003
  • fDate
    5/1/2003 12:00:00 AM
  • Firstpage
    584
  • Lastpage
    592
  • Abstract
    In this paper, we consider a floorplanning problem in the physical design of very large scale integration. We focus on the problem of placing a set of blocks (modules) on a chip with the objective of minimizing area of the chip as well as total wire length. The blocks have different areas and their shapes are either fixed (predetermined) or flexible (to be determined). We use the sequence-pair suggested by Murata et al. (see ibid, vol.15, no.12, p.1518-1524, 1996) to represent the topology of nonslicing floorplans and present two methods to obtain a floorplan from a sequence-pair. One is a construction method, and the other is a method based on a linear programming model. The two methods are embedded in simulated annealing algorithms, which are used to find a near optimal floorplan. Results of computational experiments on the Microelectronics Center of North Carolina benchmark examples show that the proposed algorithms work better than existing algorithms.
  • Keywords
    VLSI; circuit layout CAD; circuit optimisation; integrated circuit layout; linear programming; network topology; simulated annealing; VLSI design; construction method; floorplanning; linear programming model; linear programming-based algorithm; near optimal floorplan; nonslicing floorplans; physical design; sequence-pair; simulated annealing algorithms; topology; very large scale integration; Algorithm design and analysis; Circuits; Computational modeling; Linear programming; Microelectronics; Shape; Simulated annealing; Topology; Very large scale integration; Wire;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2003.810748
  • Filename
    1196201