Effect of Pb content on shear performance of SnAgCu-xSnPb/Cu mixed solder joint

Author

Wang Xin ; Li Xunping ; Pan Kailin ; Zhou Bin ; Jiang Tingbiao

Author_Institution

Sch. of Mech. & Electron. Eng., Guilin Univ. of Electron. Technol. Guilin, Guilin, China

fYear

2014

fDate

12-15 Aug. 2014

Firstpage

1173

Lastpage

1176

Abstract

In this study, the effect of series Pb content on shear performance of SnAgCu-xSnPb/Cu solder joint was investigated. It was found that Pb content influenced the BGA solder joint shear strength significantly. The shear strength as a function of Pb content shows a parabola trend. The shear strength increased with Pb content increased from 0% to 9.22%. Then the shear strength value kept at a high level from 9.22% to 26.49%. However, this trend stopped when Pb content is 29.42% and the shear strength began to decrease. The failure mode is strongly associated with fracture energy. When Pb was imported into Sn3.0Ag0.5Cu/Cu solder joint, the fracture energy (shear work) of solder joint shear test decreased. When Pb content ranges from 4.67% to 37% the fracture energy seemed no obvious difference. Pb content influenced the solidification sequence when the solder joint was cooling down. The solidification sequence is closely related to the microstructure of mixed solder joint.

Keywords

ball grid arrays; copper; copper alloys; fracture; lead alloys; mechanical testing; shear strength; silver alloys; solders; solidification; tin alloys; BGA solder joint shear strength; SnAgCu-SnPb-Cu; ball grid arrays; failure mode; fracture energy; solder joint shear test; solidification sequence; Electronics packaging; Joints; Lead; Microstructure; Reliability; Soldering; Tin; Pb content; SnAgCu-xSnPb; ball shear; mixed solder joint;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology (ICEPT), 2014 15th International Conference on

Conference_Location

Chengdu

Type

conf

DOI

10.1109/ICEPT.2014.6922852

Filename

6922852