• DocumentCode
    1188790
  • Title

    Numerical modeling of thermal response of thermofield electron emission leading to explosive electron emission

  • Author

    Jun, Sun ; Guozhi, Liu

  • Author_Institution
    Tsinghua Univ., Beijing, China
  • Volume
    33
  • Issue
    5
  • fYear
    2005
  • Firstpage
    1487
  • Lastpage
    1490
  • Abstract
    This paper gives a numerical model to deal with the thermal effect of field-induced thermal-assisted current passing through the microprotrusion on the cathode surface of a planar high-voltage vacuum diode. The model of protrusion is based on a one-dimensional truncated cone, whose physical and thermal properties have been assumed temperature dependent. The influences of space charge effect and Nottingham effect are included. According to the simulations, the delay times of explosive electron emission of cathodes made of different materials are given and compared with the experimental results, which seems to be in agreement.
  • Keywords
    electron field emission; explosions; numerical analysis; plasma diodes; plasma simulation; plasma temperature; plasma thermodynamics; plasma transport processes; plasma-wall interactions; space charge; Nottingham effect; cathode surface; explosive electron emission; field-induced thermal-assisted current; microprotrusion; one-dimensional truncated cone; planar high-voltage vacuum diode; space charge effect; thermofield electron emission; Cathodes; Current density; Delay; Diodes; Electron emission; Explosions; Explosives; Numerical models; Plasma temperature; Space charge; Delay time; Nottingham effect; explosive electron emission; microprotrusion; numerical modeling; space charge effect; thermofield electron emission;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2005.856489
  • Filename
    1518966