Title :
Reliability Analysis of Thermal Conduction of Slow-Wave Structures Assembled With Different Methods
Author :
Han, Yong ; Liu, Yan-Wen ; Ding, Yao-Gen ; Liu, Pu-Kun
Author_Institution :
Key Lab. of High Power Microwave Sources & Technol., Chinese Acad. of Sci., Beijing
fDate :
6/1/2009 12:00:00 AM
Abstract :
This paper presents the study on the thermal conduction reliability of the helix traveling-wave-tube (TWT) slow-wave structure (SWS), considering two affecting factors, such as the outside thermal condition and the manufacturing process. ANSYS has been used to analyze the variation of the heat dissipation capability of the SWS under different thermal conditions. Several experimental tests have been implemented to study the effect of the manufacturing process on the thermal conduction of the SWS. The conclusions obtained are expected be a valuable aid to the manufacture of helix TWT.
Keywords :
assembling; cooling; finite element analysis; heat conduction; reliability; slow wave structures; ANSYS; TWT; heat dissipation; helix traveling-wave-tube; reliability analysis; slow-wave structure; thermal conduction; Assembling method; heat dissipation capability; slow-wave structure (SWS);
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2009.2016755
