DocumentCode
118883
Title
A novel design of heatsink-less LED base fluorescent lamp retrofit
Author
Jia Zhao ; Yan Liu ; Hongyu Tang ; Leung, Stanley Y. Y. ; Yuan, Cadmus C. A. ; Zhang, G.Q.
Author_Institution
State Key Lab. of Solid-State Lighting, Changzhou, China
fYear
2014
fDate
12-15 Aug. 2014
Firstpage
1202
Lastpage
1207
Abstract
A new “heatsink-less” LED based T8 retrofit design is proposed in this study. The lamp consisted of light emitting elements directly attached on a flexible substrate. The substrate is mount on to the inner wall of a full cylindrical glass tube. The design is intended to simplify the lamp construction. However, since the metal-based heat sink is eliminated, the thermal design is a concern. Finite element analysis was performed to optimize the thermal design by varying metal line routing on the flexible substrate, and the glass tube structure. The optimal result shows that the junction temperatures of the LED inside the lamp is about 52°C driven under nominal current. The simulation result is comparable with the experimental measurement. In addition, Darveaux´s fatigue prediction model was implemented to calculate the thermal cycles for crack initiation and propagation, based on the inelastic strain energy density accumulated per cycle during thermal cycling. The details of the design and the optimization strategy is discussed.
Keywords
cracks; finite element analysis; fluorescent lamps; light emitting diodes; maintenance engineering; reliability; Darveaux fatigue prediction model; crack initiation; crack propagation; finite element analysis; flexible substrate; full-cylindrical glass tube; glass tube structure; heatsink-less-LED based T8 retrofit design; heatsinkless LED base fluorescent lamp retrofit; inelastic strain energy density; junction temperatures; lamp construction; light emitting elements; metal line routing; metal-based heat sink elimination; nominal current; optimization strategy; thermal cycles; thermal cycling; thermal design; Electron tubes; Finite element analysis; Glass; Heating; Light emitting diodes; Substrates; Temperature measurement; LED; flexible substrate; heat dissipation; strain based fatigue life prediction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location
Chengdu
Type
conf
DOI
10.1109/ICEPT.2014.6922859
Filename
6922859
Link To Document