DocumentCode :
1188834
Title :
Effect of thermal annealing on radiation-induced degradation of bipolar technologies when the dose rate is switched from high to low
Author :
Ducret, S. ; Saigné, F. ; Boch, J. ; Schrimpf, R.D. ; Fleetwood, D.M. ; Vaille, J.R. ; Dusseau, L. ; David, J.P. ; Ecoffet, R.
Author_Institution :
Univ. de Montpellier, France
Volume :
51
Issue :
6
fYear :
2004
Firstpage :
3219
Lastpage :
3224
Abstract :
The influence of an electrostatic barrier in the oxide bulk on the radiation-induced degradation of bipolar technologies is investigated by performing a thermal annealing operation before switching the dose rate from high to low. It is shown that, in our test conditions, no significant electrostatic barrier effect is at play in the device degradation.
Keywords :
annealing; bipolar integrated circuits; bipolar transistors; dosimetry; integrated circuit testing; radiation effects; bipolar integrated circuits; bipolar technologies; electrostatic barrier; enhanced low dose rate sensitivity; high dose rate; oxide bulk; radiation-induced degradation; thermal annealing; Annealing; Electrostatics; Helium; Impedance; Paper technology; Protons; Shape; Switches; Testing; Thermal degradation;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2004.839145
Filename :
1369473
Link To Document :
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