Title :
Charge enhancement effect in NMOS bulk transistors induced by heavy ion Irradiation-comparison with SOI
Author :
Ferlet-Cavrois, V. ; Vizkelethy, G. ; Paillet, P. ; Torres, A. ; Schwank, J.R. ; Shaneyfelt, M.R. ; Baggio, J. ; de Pontcharra, Jd.P. ; Tosti, L.
Author_Institution :
CEA/DIF, France
Abstract :
This work investigates the charge collection mechanisms occurring in heavy ion irradiated metal oxide semiconductor (MOS) devices. The parasitic bipolar effect, inherent to the structure of SOI transistors, is shown to exist in bulk NMOS transistors as well. We experimentally show that the drain junction of an OFF-state bulk MOS transistor collects more charge than an identical junction isolated from neighboring elements. In other words, the proximity of the source junction and the triggering of the bipolar-like structure are responsible of charge amplification. A higher current peak on the drain is observed, and this enhancement effect is high enough to invalidate usual charge collection models based only on funnel and diffusion transport. Thus, the proximity of other junctions has to be considered to improve charge collection model in bulk technologies.
Keywords :
MOSFET; amplification; bipolar transistors; diffusion; ion beam effects; NMOS bulk transistors; OFF-state bulk MOS transistor; SOI; SOI transistors; bipolar-like structure triggering; bulk NMOS transistors; charge amplification; charge collection mechanisms; charge collection models; charge enhancement effect; diffusion transport; drain junction; funnel transport; heavy ion irradiated metal oxide semiconductor devices; heavy ion irradiation; higher current peak; identical junction; neighboring elements; parasitic bipolar effect; source junction; Character generation; Doping profiles; Integrated circuit technology; Laboratories; MOS devices; MOSFETs; National security; Nuclear power generation; Single event transient; Single event upset;
Journal_Title :
Nuclear Science, IEEE Transactions on
DOI :
10.1109/TNS.2004.839167