Failure analysis for IC plastic and substrate/lead-frame package

In this paper, the recent two years of failure analysis cases of our laboratory are screened and some of them are displayed, they are mostly selected with a relation to the influence of temperature and humidity. To illustrate the typical and common failure phenomenon, plastic packaging products are focused. The main failure mode of these failed products include package delaminations, solder abnormality, moisture ingress. By finding out the occurrence mechanism and summing up these issues, the corresponding analysis for improvement and preventive measures were put forward. In addition, for this paper, some significant failure analysis technologies and equipments are performed, and the related pictures, make sense and useful, impress the understanding of the readers.