Title :
High-Linearity CMOS T/R Switch Design Above 20 GHz Using Asymmetrical Topology and AC-Floating Bias
Author :
Park, Piljae ; Shin, Dong Hun ; Yue, C. Patrick
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of California at Santa Barbara, Santa Barbara, CA
fDate :
4/1/2009 12:00:00 AM
Abstract :
This paper presents circuit techniques to achieve high linearity and good isolation for CMOS transmit/receive (T/R) switches above 20 GHz. A comparison between the conventional symmetrical and the proposed asymmetrical switch topology is presented with an emphasis on the linearity performance. The substrate loading effects on T/R switch figure of merit are analyzed quantitatively based on a compact model of triple-well (TW) NMOS device. AC-floating bias techniques used for the T/R switch and the associated performance tradeoffs are discussed. By combining these techniques, an LC-tuned 24-GHz single-pole double-throw T/R switch is implemented in a 90-nm TW CMOS process. The switch uses 1.2-V digital control signals for both T/R mode selection and source/drain biases. The design achieves a measured P1dB of 28.7 dBm, which represents the highest linearity reported to date for CMOS millimeter-wave switches. The measured insertion loss and return loss at 24 GHz are better than 3.5 and 10 dB, respectively.
Keywords :
CMOS integrated circuits; integrated circuit design; millimetre wave integrated circuits; switches; transceivers; AC-floating bias; CMOS millimeter-wave switches; CMOS transmit-receive switches; LC-tuned single-pole double-throw T/R switch; T/R mode selection; asymmetrical switch topology; digital control signal; frequency 24 GHz; high-linearity CMOS T/R switch design; insertion loss; loss 10 dB; loss 3.2 dB; return loss; size 90 nm; source-drain biases; substrate loading effect; triple-well NMOS device; voltage 1.2 V; 1-dB compression point; AC-floating biasing technique; T/R switch; asymmetrical transmit/receive (T/R) switch topology; triple-well (TW) CMOS;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2009.2014450