Title :
Quick Determination of Thermal Conductivity of Potting Compounds by a Transient Technique
Abstract :
This paper is based on a study made by the author of a simple and reasonably accurate transient method for determining the thermal conductivity of potting compounds. This method used a cylindrical test specimen with axial heat addition. The shape of the specimen described in this report has no bearing on the measurement as long as the specimen is of sufficient size. This paper presents mathematical proofs of the transient method studied, describes apparatus for making tests, and gives comparative results between transient method and steady-state method.
Keywords :
Conducting materials; Conductivity measurement; Electronic packaging thermal management; Fourier transforms; Shape measurement; Steady-state; Testing; Thermal conductivity; Time measurement; Wire;
Journal_Title :
Instrumentation and Measurement, IEEE Transactions on
DOI :
10.1109/TIM.1965.4313440