DocumentCode :
118958
Title :
Novel design of a compact band-pass filter with two finite transmission zeros using LTCC technology
Author :
Zhiyu Zhao ; Yingli Liu ; Kai Yang ; Lei Shi ; Liyun Gan
Author_Institution :
Sch. of Microelectron. & Solid-State Electron., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1308
Lastpage :
1311
Abstract :
A novel method to design a compact low-temperature co-fired ceramics (LTCC) lumped-element second-order band-pass filter with two finite transmission zeros is proposed in this paper. The filter model is established according to the capacitor coupling resonance band-pass filter´s circuit structure and the connect type of embedded coupling capacitor was neatly designed to make it be linked between input port and output port. The simulation results show that two transmission zeros are produced by the common grounded inductor between two resonators. This band-pass filter has a compact structure and occupies an area of only 2mm × 1.2mm × 0.95mm according to the package size of 0805. After the physical model and inner structure of the BPF are established, the samples are fabricated by LTCC technology. The measurement results show that the insertion loss is less than 2.5dB and return loss is less than -20dB at the center frequency of 2.45GHz, which agree basically with the simulation results.
Keywords :
UHF filters; band-pass filters; capacitors; ceramics; cryogenic electronics; inductors; resonator filters; BPF; LTCC technology; capacitor coupling resonance filter circuit structure; common grounded inductor; compact low-temperature cofired ceramics; connect type; embedded coupling capacitor; finite transmission zeros; frequency 2.45 GHz; lumped-element second-order band-pass filter; physical model; Band-pass filters; Couplings; Filtering theory; Inductors; Loss measurement; Microwave filters; Resonator filters; HFSS simulation; LTCC; band-pass filter; finite transmission zero;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922885
Filename :
6922885
Link To Document :
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