Warpage analysis of DBC substrate based on non-contact shadow moiré technology

During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were cut was selected as the measure object. A measurement system based on non-contact shadow moiré technology is applied to obtain the three dimensional profile of this array of DBC substrate. The warpage of the whole field of array of DBC substrate and the height of single substrate obtained.