DocumentCode :
119063
Title :
Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests
Author :
Zhang, Grace G. ; Lu, Sophie L. Y. ; Yang, Nick G. M. ; Zou, Sam H. Y. ; Zhong, Steven D. L. ; Lo, Jeffery C. C. ; Lee, S. W. Ricky
Author_Institution :
HKUST LED-FPD Technol. R&D Center at Foshan, Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2014
fDate :
12-15 Aug. 2014
Firstpage :
1477
Lastpage :
1481
Abstract :
In this paper, a fully automated, low-cost, real-time illuminance measurement system for LED long term reliability tests is proposed. The system has only one photodetector to measure the illuminance of all samples inside the test chamber during the reliability test. With a proprietary algorithm, a single photodetector can measure the illuminance of all samples in the chamber by sequential scanning. This system monitors and records the illuminance of each individual sample inside the test chamber. This provides continuous and reliable data for analysis and prediction of LED lifespan. It does not require suspending the reliability test for sample inspection and can automatically analyze the time-to-failure of samples. The proposed system can significantly reduce the time required for data acquisition and measurement errors. This paper also compares the results obtained from the proposed system and the conventional periodic inspection to highlight the merits of the new system.
Keywords :
light emitting diodes; photodetectors; reliability; LED lifespan; LED long-term reliability test; data acquisition; fully-automated low-cost real-time illuminance measurement system; measurement errors; periodic inspection; photodetector; proprietary algorithm; real-time monitoring system development; sample inspection; sample time-to-failure; sequential scanning; test chamber; time reduction; uniphotodetector; Abstracts; Decision support systems; IEEE standards; Light emitting diodes; Photonics; Real-time systems; Reliability; LED; illuminance; reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology (ICEPT), 2014 15th International Conference on
Conference_Location :
Chengdu
Type :
conf
DOI :
10.1109/ICEPT.2014.6922933
Filename :
6922933
Link To Document :
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