High moment soft FeCoN/NiFe laminated thin films

Author

Jiang, Hai ; Sin, Kyusik ; Chen, Yingjian

Author_Institution

Western Digital Corp., Fremont, CA, USA

Volume

41

Issue

10

fYear

2005

Firstpage

2896

Lastpage

2898

Abstract

Fe₇₀Co₃₀N/Ni₅₅Fe₄₅ laminated thin films were sputtered onto the glass and Si wafers by dc magnetron sputtering using different N₂/Ar gas mixtures. The structure and magnetic properties of the films were investigated by the XRD, TEM, and B-H loop tracer. A soft FeCoN/NiFe laminated thin film with a B_S of 2.40 T and a well-defined uniaxial anisotropy has been achieved at the optimized conditions. It was found that the incorporation of nitrogen in the FeCo films does not change the lattice constant of FeCo, but it does change the film stress from compressive to tensile. It is believed that the combination of tensile stress and positive magnetostriction maintains the softness of FeCoN/NiFe laminated thin film beyond 1 μm.

Keywords

X-ray diffraction; gas mixtures; iron alloys; magnetic anisotropy; magnetic moments; magnetic thin films; nickel alloys; sputter deposition; transmission electron microscopy; B-H loop tracer; FeCoN; NiFe; TEM; XRD; dc magnetron sputtering; high moment materials; inductive write head; laminated thin films; positive magnetostriction; tensile stress; uniaxial anisotropy; Argon; Glass; Iron; Magnetic anisotropy; Magnetostriction; Perpendicular magnetic anisotropy; Semiconductor thin films; Sputtering; Tensile stress; Transistors; FeCo alloys; high moment materials; inductive write head;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2005.855306

Filename

1519154