Title :
Vertically Stacked SiGe Nanowire Array Channel CMOS Transistors
Author :
Fang, W.W. ; Singh, N. ; Bera, L.K. ; Nguyen, H.S. ; Rustagi, S.C. ; Lo, G.Q. ; Balasubramanian, N. ; Kwong, D.L.
Author_Institution :
Inst. of Microelectron., Singapore
fDate :
3/1/2007 12:00:00 AM
Abstract :
We demonstrate, for the first time, the fabrication of vertically stacked SiGe nanowire (NW) arrays with a fully CMOS compatible technique. Our method uses the phenomenon of Ge condensation onto Si and the faster oxidation rate of SiGe than Si to realize the vertical stacking of NWs. Gate-all-around nand p-FETs, fabricated using these stacked NW arrays as the channel (Lgges0.35 mum), exhibit excellent device performance with high ION/IOFF ratio (~106), near ideal subthreshold slope (~62-75 mV/dec) and low drain induced barrier-lowering (~20 mV/V). The transconductance characteristics suggest quantum confinement of holes in the [Ge]-rich outer-surface of SiGe for p-FETs and confinement of electrons in the core Si with significantly less [Ge] for n-FETs. The presented device architecture can be a promising option to overcome the low drive current restriction of Si NW MOSFETs for a given planar estate
Keywords :
CMOS integrated circuits; Ge-Si alloys; MOSFET; condensation; germanium; nanowires; oxidation; silicon; CMOS compatible technique; CMOS transistors; Ge condensation; Si NW MOSFET; SiGe; SiGe nanowire array; gate-all-around n-FET; gate-all-around p-FET; oxidation rate; quantum confinement; transconductance characteristics; vertically stacked nanowire array; CMOS technology; Charge carrier processes; Fabrication; Germanium silicon alloys; MOSFETs; Oxidation; Potential well; Silicon germanium; Stacking; Transconductance; Gate-all-around (GAA); MOSFETs; SiGe nanowire (NW); vertically stacked NW array;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2007.891268