DocumentCode
1191452
Title
Vertically Stacked SiGe Nanowire Array Channel CMOS Transistors
Author
Fang, W.W. ; Singh, N. ; Bera, L.K. ; Nguyen, H.S. ; Rustagi, S.C. ; Lo, G.Q. ; Balasubramanian, N. ; Kwong, D.L.
Author_Institution
Inst. of Microelectron., Singapore
Volume
28
Issue
3
fYear
2007
fDate
3/1/2007 12:00:00 AM
Firstpage
211
Lastpage
213
Abstract
We demonstrate, for the first time, the fabrication of vertically stacked SiGe nanowire (NW) arrays with a fully CMOS compatible technique. Our method uses the phenomenon of Ge condensation onto Si and the faster oxidation rate of SiGe than Si to realize the vertical stacking of NWs. Gate-all-around nand p-FETs, fabricated using these stacked NW arrays as the channel (Lgges0.35 mum), exhibit excellent device performance with high ION/IOFF ratio (~106), near ideal subthreshold slope (~62-75 mV/dec) and low drain induced barrier-lowering (~20 mV/V). The transconductance characteristics suggest quantum confinement of holes in the [Ge]-rich outer-surface of SiGe for p-FETs and confinement of electrons in the core Si with significantly less [Ge] for n-FETs. The presented device architecture can be a promising option to overcome the low drive current restriction of Si NW MOSFETs for a given planar estate
Keywords
CMOS integrated circuits; Ge-Si alloys; MOSFET; condensation; germanium; nanowires; oxidation; silicon; CMOS compatible technique; CMOS transistors; Ge condensation; Si NW MOSFET; SiGe; SiGe nanowire array; gate-all-around n-FET; gate-all-around p-FET; oxidation rate; quantum confinement; transconductance characteristics; vertically stacked nanowire array; CMOS technology; Charge carrier processes; Fabrication; Germanium silicon alloys; MOSFETs; Oxidation; Potential well; Silicon germanium; Stacking; Transconductance; Gate-all-around (GAA); MOSFETs; SiGe nanowire (NW); vertically stacked NW array;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2007.891268
Filename
4114569
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