• DocumentCode
    1192685
  • Title

    Guidelines for reverse short-channel behavior

  • Author

    Mazuré, C. ; Orlowski, M.

  • Author_Institution
    Siemens AG, Munich, West Germany
  • Volume
    10
  • Issue
    12
  • fYear
    1989
  • Firstpage
    556
  • Lastpage
    558
  • Abstract
    Necessary conditions for the occurrence of the reverse short-channel (RSC) effect for threshold voltage V/sub T/ for submicrometer MOSFETs due to channel profile nonuniformity are established: (1) sufficiently large concentration decrease towards the Si-SiO/sub 2/ interface of the channel doping (not necessarily a peak below the surface); (2) laterally nonhomogeneous enhancement of the diffusivity of the channel dopant either by injection of interstitials or vacancies from outside the gate region; and (3) the minimal distance between the point-defect injection next to the gate and the metallurgical channel-to-drain junction is smaller than the characteristic lateral decay length of the point defects. The above conditions are corroborated by the conditions for the threshold-voltage enhancement at the small channel lengths reported.<>
  • Keywords
    insulated gate field effect transistors; Si-SiO/sub 2/ interface; channel doping; channel profile nonuniformity; characteristic lateral decay length; concentration decrease; guidelines; necessary conditions; nonhomogeneous enhancement of doping diffusivity; point defects; reverse short-channel behavior; small channel lengths; submicrometer MOSFETs; submicron devices; threshold-voltage enhancement; Boron; Doping profiles; Guidelines; Implants; MOSFET circuits; Region 3; Semiconductor process modeling; Spatial resolution; Terrorism; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/55.43138
  • Filename
    43138