Title :
40-gb/s EA modulators with wide temperature operation and negative chirp
Author :
Billia, Luca ; Zhu, Jintian ; Ranganath, Tirumala ; Bour, David P. ; Corzine, Scott W. ; Höfler, Gloria E.
Author_Institution :
Turin Technol. Center, Italy
Abstract :
Broad bandwidth external modulators are widely used in optical fiber networks to avoid the chirp associated with the direct modulation of laser diode sources. For transmission application beyond 10 Gb/s, electroabsorption modulators (EAMs) offer many advantages such as low drive voltage, low chirp characteristics, small size, and added functionality through integration with a distributed feedback laser. In this letter, we present static and dynamic characterization of an EAM demonstrating the possibility to have with the same device uncooled operation at 40 Gb/s and negative chirp at low negative bias. These features are attractive for cost reduction in short link applications and for long-haul transmission. All the measurements are performed at 40 Gb/s from room temperature up to 60°C demonstrating a negative chirp behavior for the stand-alone modulator over the entire temperature range.
Keywords :
chirp modulation; electro-optical modulation; electroabsorption; optical fibre networks; semiconductor devices; semiconductor quantum wells; 20 to 60 degC; 40 Gbit/s; broad bandwidth external modulators; distributed feedback laser; dynamic characterization; electroabsorption modulators; long-haul transmission; low chirp characteristics; low drive voltage; low negative bias; multiple quantum wells; negative chirp; optical fiber networks; room temperature; semiconductor devices; short link applications; static characterization; uncooled operation; wide temperature operation; Bandwidth; Chirp modulation; Diode lasers; Distributed feedback devices; Drives; Fiber lasers; Laser feedback; Low voltage; Optical fiber networks; Temperature distribution; Chirp modulation; electroabsorption; measurement; wide temperature operation;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2004.837921