Title :
Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package
Author :
Noh, Bo-In ; Yoon, Jeong-Won ; Jung, Seung-Boo
Author_Institution :
Sch. of Adv. Mater. Sci. & Eng., Sungkyunkwan Univ., Suwon, South Korea
Abstract :
The thermomechanical reliability of chip-scale packages (CSPs) with various underfills was evaluated by measure the electrical resistance under thermal shock and four-point bending fatigue tests. The underfill containing cycloaliphatic-type epoxy resin had lower resistance than without cycloaliphatic-type epoxy resin under thermomechanical fatigue test because the cycloaliphatic-type epoxy resin was able to mechanically relax more than the other types. The lifetimes of the CSPs under thermomechanical fatigues were strongly dependent on the properties of the underfill.
Keywords :
bending; chip scale packaging; fatigue testing; polymers; reliability; thermal analysis; chip scale package; cycloaliphatic-type epoxy resin; electrical resistance measurement; four-point bending fatigue tests; mechanical reliability; thermal cycling; thermal shock; thermomechanical fatigue test; underfill material effects; Chip-scale package (CSP); bending fatigue test; thermal cycling; thermal fatigue test; underfill;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2008.2010503
