Condensation and Growth of Kirkendall Voids in Intermetallic Compounds

Author

Weinberg, Kerstin ; Böhme, Thomas

Author_Institution

Lehrstuhl fur Festkorpermechanik, Univ. Siegen, Siegen, Germany

Volume

32

Issue

3

fYear

2009

Firstpage

684

Lastpage

692

Abstract

A model for the simulation of Kirkendall voiding in metallic materials is presented based on vacancy diffusion, elastic-plastic and rate-dependent deformation of the material. Starting with a phenomenological explanation of the Kirkendall effect we briefly discuss the consequences on the reliability of microelectronic components. Then, a constitutive model for void nucleation and growth is introduced, which can be used to predict the temporal development of voids in solder joints during thermal cycling. We present numerical studies and discuss the potential of the results for the failure analysis of joining connections.

Keywords

Young´s modulus; chemical interdiffusion; condensation; copper alloys; crystal growth; elastic deformation; joining processes; nucleation; plastic deformation; reliability; solders; tin alloys; vacancies (crystal); voids (solid); Cu₃Sn; Kirkendall voids; Young´s modulus; condensation; elastic-plastic deformation; intermetallic compounds; joining connections; microelectronic components; nucleation; phenomenological explanation; rate-dependent deformation; reliability; thermal cycling; vacancy diffusion; Intermetallic compounds; Kirkendall effect; plastic deformation; vacancy diffusion; void distribution; void growth; void nucleation;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2008.2010057

Filename

4801568