Title :
Dynamic response analysis of pyroelectric sensitive element for thermal imaging
Author :
Yoon, Yung Sup ; Samoilov, Vladimir B. ; Kletsky, Sergei V.
Author_Institution :
Res. Inst. of Semicond. & Thin Film Technol., Inha Univ., Inchon, South Korea
fDate :
4/1/2003 12:00:00 AM
Abstract :
Temperature distributions under periodic thermal excitations and the responsivity of a pyroelectric device consisting of a cover layer, infrared absorber, metal contact, sensitive pyroelectric element, interconnecting column, and bulk silicon are found. Some results of numerical thermal modeling and analysis of exact expressions for a few extreme cases are presented. Pyroelectric responses of real structures are compared with the response of a single pyroelectric element in air as a limiting case of maximum sensitivity. The analytical approximations and numerical simulation show that the frequency response of the multilayered structure consists of different parts with simple frequency dependencies. In the region of high frequencies of light modulation, the responsivity is proportional to /spl omega//sup -1/, at low frequencies /spl sim/ /spl omega//sup -0.5/, and, in the region of intermediate frequencies, the voltage responsivity is independent of frequency.
Keywords :
dynamic response; frequency response; image sensors; infrared detectors; infrared imaging; modelling; pyroelectric detectors; sensitivity; temperature distribution; thermal analysis; Si; bulk Si; cover layer; dynamic response analysis; frequency response; infrared absorber; interconnecting column; metal contact; multilayered structure; periodic thermal excitations; pyroelectric device responsivity; pyroelectric sensitive element; solid-state pyroelectric imaging; temperature distributions; thermal imaging; Frequency modulation; Frequency response; Image analysis; Numerical models; Numerical simulation; Optical imaging; Pyroelectric devices; Pyroelectricity; Silicon; Temperature distribution; Computer Simulation; Computer-Aided Design; Crystallization; Equipment Design; Equipment Failure Analysis; Infrared Rays; Models, Theoretical; Photochemistry; Sensitivity and Specificity; Thermography; Transducers;
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
DOI :
10.1109/TUFFC.2003.1197970