Title :
Two-Dimensional Optical Interconnection Based on Two-Layered Optical Printed Circuit Board
Author :
Hwang, Sung Hwan ; Cho, Mu Hee ; Kang, Sae-Kyoung ; Lee, Tae-Woo ; Park, Hyo-Hoon ; Rho, Byung Sup
Author_Institution :
Opt. Interconnection & Switching Lab., Inf. & Commun. Univ., Daejeon
fDate :
3/15/2007 12:00:00 AM
Abstract :
The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission
Keywords :
integrated optics; integrated optoelectronics; optical fibre communication; optical fibres; optical interconnections; optical losses; optical receivers; optical transmitters; 96 Gbit/s; bent fiber connectors; chip-to-chip optical interconnection; connector-embedded OPCB; optical platform; optical printed circuit board; optical receiver; optical transmitter; passive assembly technology; six-channel fiber connectors; six-channel fiber-OPCB; two-dimensional optical interconnection; two-layered OPCB; Assembly; Connectors; Optical design; Optical interconnections; Optical losses; Optical receivers; Optical transmitters; Printed circuits; Throughput; Two dimensional displays; 90$^{circ}$ -bent fiber block; chip-to-chip optical interconnection; optical modules; optical printed circuit board (OPCB); passive assembly;
Journal_Title :
Photonics Technology Letters, IEEE
DOI :
10.1109/LPT.2007.892888
