Title :
A method to predict cracking in IC plastic packages
Author :
Margaritis, G. ; McGarry, F.J.
Author_Institution :
Dept. of Mater. Sci. & Eng., MIT, Cambridge, MA, USA
fDate :
5/1/1994 12:00:00 AM
Abstract :
We present a method to predict cracking in a model geometry, representing an IC plastic package, under monotonic thermal loading, when no delaminations are present. The results of the analysis are expressed in a dimensionless form so they are generally applicable. A critical relation between the residual stress in the polymer and its tensile strength predicts fracture. Experimental results with a commercial encapsulant show good agreement with the analysis
Keywords :
encapsulation; finite element analysis; fracture; integrated circuit technology; packaging; tensile strength; thermal stress cracking; IC plastic packages; cracking; encapsulant; fracture; model geometry; monotonic thermal loading; polymer; residual stress; tensile strength; Capacitive sensors; Encapsulation; Integrated circuit modeling; Plastic integrated circuit packaging; Residual stresses; Semiconductor device measurement; Solid modeling; Strain measurement; Testing; Thermal stresses;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
