Advanced design and modeling for manufacturability of a hybrid MCM package

Author

Kadakia, Suresh D. ; Donovan, Thomas E. ; Gupta, Dinesh ; Bhatia, Harsaran

Author_Institution

IBM Corp., Hopewell Junction, NY, USA

Volume

17

Issue

2

fYear

1994

fDate

5/1/1994 12:00:00 AM

Firstpage

170

Lastpage

174

Abstract

The objective of this paper is to focus on manufacturability aspects of the MCM package through advanced design and modeling techniques. Two types of modeling are discussed: electrical and process. Use of electrical modeling to enhance manufacturability is demonstrated. Process modeling is driven by the requirements to maximize yield. A Poisson model which relates the product complexity and process characteristics to electrical yield are discussed. Three phases of advanced design techniques, namely cube design, substrate design and thin film design are shown to reduce cycle time and also manufacturing defects

Keywords

electronic equipment manufacture; multichip modules; Poisson model; cube design; cycle time; electrical modeling; hybrid MCM package; manufacturability; manufacturing defects; modeling techniques; process characteristics; process modeling; product complexity; substrate design; thin film design; yield; Conducting materials; Costs; Dielectric materials; Impedance; Manufacturing processes; Packaging; Substrates; Testing; Transistors; Virtual manufacturing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.330433

Filename

330433