DocumentCode
1194219
Title
A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages
Author
Dauksher, Walter ; Lau, John
Author_Institution
Avago Technol., Fort Collins, CO
Volume
9
Issue
2
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
231
Lastpage
236
Abstract
A finite-element-based modeling methodology for predicting the part-on-board fatigue life of lead-free solder balls is presented. The computationally efficient methodology is calibrated with a wide assortment of published test data.
Keywords
ball grid arrays; copper alloys; fatigue testing; finite element analysis; life testing; silver alloys; solders; tin alloys; SnAgCu; ball-grid-array package; finite-element-based modeling methodology; lead-free solder ball; solder-joint fatigue-life prediction methodology; Fatigue; finite element; lead-free solder;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2009.2014943
Filename
4801639
Link To Document