Title :
A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages
Author :
Dauksher, Walter ; Lau, John
Author_Institution :
Avago Technol., Fort Collins, CO
fDate :
6/1/2009 12:00:00 AM
Abstract :
A finite-element-based modeling methodology for predicting the part-on-board fatigue life of lead-free solder balls is presented. The computationally efficient methodology is calibrated with a wide assortment of published test data.
Keywords :
ball grid arrays; copper alloys; fatigue testing; finite element analysis; life testing; silver alloys; solders; tin alloys; SnAgCu; ball-grid-array package; finite-element-based modeling methodology; lead-free solder ball; solder-joint fatigue-life prediction methodology; Fatigue; finite element; lead-free solder;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2009.2014943
