DocumentCode :
1195166
Title :
Gain-enhanced LDD NMOS device using cesium implantation
Author :
Pfiester, James R. ; Alvis, John R. ; Gunderson, Craig D.
Author_Institution :
Motorola Inc., Austin, TX, USA
Volume :
39
Issue :
6
fYear :
1992
fDate :
6/1/1992 12:00:00 AM
Firstpage :
1469
Lastpage :
1476
Abstract :
A gain-enhanced LDD NMOS device has been developed for a submicrometer CMOS technology. Using cesium implantation to create a fixed positive charge at the oxide/silicon interface above the LDD region, improvements in device gain are obtained without degradation to hot-carrier reliability or short-channel behavior. Since fixed charge rather than an extended polysilicon gate is used to overlap the LDD regions, no penalty is paid in terms of extra gate overlap capacitance. Furthermore, this structure is easily integrated into a conventional twin-tub CMOS process with the addition of only one cesium implantation step which is performed at the same time as the LDD n- implant step
Keywords :
CMOS integrated circuits; caesium; hot carriers; insulated gate field effect transistors; integrated circuit technology; ion implantation; MOSFET; Si:Cs+-SiO2; device gain; fixed positive charge; gain-enhanced LDD NMOS device; gate overlap capacitance; hot-carrier reliability; ion implantation; short-channel behavior; submicrometer CMOS technology; twin-tub CMOS process; CMOS process; CMOS technology; Capacitance; Degradation; Electrons; Hot carriers; Implants; MOS devices; MOSFETs; Silicon;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.137328
Filename :
137328
Link To Document :
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