DocumentCode
1197414
Title
Benzocyclobutene wafer bonding for III-V nanophotonic guiding structures
Author
Lauvernier, D. ; Vilcot, J.P. ; Garidel, S. ; McMurtry, S. ; Decoster, D.
Author_Institution
Inst. d´´Electronique, Univ. des Sci. et Technol. de Lille, Villeneuve d´´Ascq, France
Volume
41
Issue
21
fYear
2005
Firstpage
1170
Lastpage
1172
Abstract
An adhesive wafer bonding technique for the fabrication of nanophotonic guiding structures, the design of which consists of a III-V semiconductor core buried in a polymer matrix, is reported. The bonding was realised owing to benzocyclobutene. Nanostructures are perfectly embedded in the void-free matrix to form high density photonic circuits.
Keywords
III-V semiconductors; adhesive bonding; integrated optics; optical waveguides; polymer structure; wafer bonding; Benzocyclobutene; III-V semiconductor; adhesive wafer bonding; high density photonic circuits; nanophotonic guiding structures; polymer matrix; void-free matrix;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20052704
Filename
1522016
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