DocumentCode
1197692
Title
Foreword Special Section on Tin Whiskers
Author
Gedney, Ronald W.
Volume
30
Issue
1
fYear
2007
Firstpage
1
Lastpage
1
Abstract
The four papers in this special section focus on tin whiskers. Two of the four papers are based on presentations given at the Tin Whisker Workshop sponsored by the ECTC, iNEMI, and NIST on May 30, 2006. The papers are briefly summarized here.
Keywords
Atomic layer deposition; Components, Packaging, and Manufacturing Technology Society; Corrosion; Electronic components; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Semiconductor device manufacture; Semiconductor device packaging; Tin;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2007.893268
Filename
4118345
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