Title :
Foreword Special Section on Tin Whiskers
Author :
Gedney, Ronald W.
Abstract :
The four papers in this special section focus on tin whiskers. Two of the four papers are based on presentations given at the Tin Whisker Workshop sponsored by the ECTC, iNEMI, and NIST on May 30, 2006. The papers are briefly summarized here.
Keywords :
Atomic layer deposition; Components, Packaging, and Manufacturing Technology Society; Corrosion; Electronic components; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Semiconductor device manufacture; Semiconductor device packaging; Tin;
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
DOI :
10.1109/TEPM.2007.893268
