Low-Loss Patterned Ground Shield Interconnect Transmission Lines in Advanced IC Processes

Author

Tiemeijer, Luuk F. ; Pijper, Ralf M T ; Havens, Ramon J. ; Hubert, Olivier

Author_Institution

Res. Dept., NXP Semicond., Eindhoven

Volume

55

Issue

3

fYear

2007

fDate

3/1/2007 12:00:00 AM

Firstpage

561

Lastpage

570

Abstract

In this paper, we provide an extensive experimental and theoretical study of the benefits of patterned ground shield interconnect transmission lines over more conventional layouts in advanced integrated-circuit processes. As part of this experimental work, we present the first comparative study taken on truly differential transmission line test structures. Our experimental results obtained on transmission lines with patterned ground shields are compared against a predictive compact equivalent-circuit model. This model employs exact closed-form expressions for the inductances, and describes key performance figures such as characteristic impedance and attenuation loss with excellent accuracy

Keywords

electromagnetic shielding; equivalent circuits; integrated circuit interconnections; integrated circuit layout; transmission lines; advanced integrated circuit process; attenuation loss; characteristic impedance; differential transmission line test structures; equivalent-circuit model; on-wafer microwave measurements; patterned ground shield interconnect transmission lines; Coplanar transmission lines; Coplanar waveguides; Dielectric losses; Distributed parameter circuits; Inductance; Integrated circuit interconnections; Power transmission lines; Propagation losses; Transmission line theory; Transmission lines; Calibration; deembedding; integrated circuits (ICs); on-chip interconnect transmission lines; on-wafer micro wave measurements;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/TMTT.2007.891691

Filename

4118416